semiconductor cooling equipment

Abstract

Abstract PURPOSE:To improve the property of heat dissipation by enlarging the contact area of a piston with a metal to be processed, using a magnetic fluid, and to enable moderate contact with a semiconductor element and the prevention of piston removal by a method wherein the space between the metal and the piston is made air-tight. CONSTITUTION:The gap between a cylindrical recess 3 and the piston 4 is filled with the magnetic fluid 10 containing a metal as the main constituent, and the heat resistance is made much smaller by secure surface-contact of the recess with the piston by the magnetic suction force acting on the fluid. Further, the piston is brought into contact with the semiconductor element 5 under a positive pressure produced in a space 8 by the air-tightening of the space due to the action of the fluid. Besides, in the case of removing a card assembly including the elements and a wiring substrate 6 for the purpose of repairing and the like, the removal of the piston dus to a negative pressure produced in the space is prevented. The metal 2 to be processed is cooled to a suitable temperature by a cooling liquid flowing through a passage 1, and the piston contacts with the element under a moderate pressure and then transfers the heat of the element to the metal.

Inventors

• 👤 Hirokazu Toya
• 👤 弘和 遠矢

Bibliographic Details