Plating device

Abstract

Abstract PURPOSE:To form a plating film at a uniform thickness on the surface of a base plate in the stage of subjecting the surface of the base plate to electroplating by fixing the rear of the base plate by vacuum suction to a fixing jig in a plating liquid and adhering a cathode plate to the rear surface. CONSTITUTION:The rear surface of a base plate 21 to be plated is attached via an O-ring 23 to a fixing jig 22 and a cathode plate 26 is adhered via conductive or ordinary sponge 25 to the rear surface of the plate 21. A conductor 27 from the negative electrode of a power source E is connected through an insulating pipe 28 to the plate 27. The space 22a in the jig 22 is communicated to a vacu- um pump, via the pipe 28 by which the inside of the space is evacuated and the plate 21 is attracted and held via the sponge 25 to the inside surface of the jig 22. A DC voltage or pulse voltage is impressed between said plate and an anode 32 facing the base plate in this state to electroplate the surface of the plate 21 by passing the plating liquid 31. Since the plate 21 is adhered to the plane- shaped cathode plate 26 on the rear surface, there is no potential gradient in the base plate and the plating film is formed over the entire surface at a uniform thickness.

Inventors

• 👤 Katsumi Suzuki
• 👤 克美 鈴木

Bibliographic Details