Semiconductor device

Abstract

Abstract PURPOSE:To enable to make a contribution to increase cavity to reduce wiring capacitance and the like of the titled semiconductor device by a method wherein a plurality of pads having the same function are provided, and a suitable pad is selected and connected to each package, thereby enabling to make short a lead wire. CONSTITUTION:Each of pads 1-16 has different kind of function respectively, and it is arranged along the two sides of the semiconductor device. Pads 4', 5', 12' and 13' have the function same as that of the pads 4, 5, 12 and 13. Accordingly, when they are mounted on a package, a lead wiring is performed on either of 4 and 4', 5 and 5', 12 and 12', and 13 and 13'. As a pad suitable for a package can be selected as above-mentioned, a lead wiring can be made shorter, thereby enabling to increase the cavity, to contribute reduction in the wiring capacitance and to simplify the performance of a wire bonding.

Inventors

• 👤 Yoshihiro Takemae
• 👤 義博 竹前
• 👤 Tomio Nakano
• 👤 中野　富男
• 👤 Kimiaki Sato
• 👤 公昭 佐藤
• 👤 Masataka Mizukoshi
• 👤 正孝 水越

Bibliographic Details