Semiconductor device

Abstract

Abstract PURPOSE:To eliminate an external lens system and obtain a small and low cost device by a method wherein, in a solid-state image pick up device as an application of a photoelectromotive force effect, a convex lens is provided to a package in which a semiconductor die is mounted in order to collect optical information efficiently at a photodetector part. CONSTITUTION:A recessed part is provided to a surface of a package 9 with leads 8 dropping from both ends. A semiconductor die 10 which has a photo-detector part 4 as a photoelectric conversion part is fixed in the recessed part with the photodetector part 4 facing up. Electrode terminals provided to the semiconductor die 10 are connected to wirings near the die 10 by wires 11. The surface of the recessed part is covered and sealed with a convex lens which has a convex surface at its lower side instead of a conventional flat glass cap. With this constitution, collecting efficiency of optical information 7 at the photodetector part 4 is improved and the device itself can have a light converging ability so that the device can be made smaller.

Inventors

• 👤 Yoshimichi Watabe
• 👤 渡部　良道

Bibliographic Details