Package construction of semiconductor integrated circuit device

Abstract

Abstract PURPOSE:To increase the number of accommodated pins while minimizing a package by surrounding the outer circumference of a block for fixing a semiconductor tip with plural number of blocks for fixing pins, the blocks being penetrated by the pins, to externally connect the terminal of electrode provided on the semiconductor tip which is fixed on the block and by making the top of the pin higher toward the outer circumference. CONSTITUTION:The outer circumference of a block 7 on which a semiconductor tip 3 is fixed is surrounded by fixed blocks 8 and 9 which are each planted and penetrated with a pin 10. In this construction, copper alloy is used to obtain higher heat dissipation and such as cobalt is used when heat-dissipated expansion is required in the block 7. In the blocks 8 and 9, epoxide or silicone resion is also used. The height of the top of the outermost pin 10 is made higher than the height of the inner pin 10 to avoid such as contact when the pin 10 is connected to the electrode wiring provided on the tip 3.

Inventors

• 👤 Nobuo Ogasa
• 👤 小笠　伸夫
• 👤 Akira Otsuka
• 👤 昭 大塚
• 👤 Kazuo Kanehiro
• 👤 金廣　一雄

Bibliographic Details