← Back to Patent Explorer
JPS60759A Expired / Lapsed JP ⏱️ 0.0 years remaining

Semiconductor element carrier

Assignee: Hitachi Ltd
•
Filing: 1983-06-17
•
Granted: —
•
Expires: 2003-06-17
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract PURPOSE:To facilitate the inspection of connection parts at the step of connection between external connection members and the titled carrier by leading a bonding pattern out of the cap. CONSTITUTION:Said carrier 7 has the bonding pattern 3 led out of the cap 2', and the extension of the pattern 3 being made as an inspection pattern 11. Therefore, the contact of a contactor for conducting inspection with this pattern 11 becomes facilitated. Since the connection parts 8 are connected to an external pattern 10 via internal wiring in a wiring substrate 4, the conducting inspection by the contact of the contactor with the pattern 11 and the pattern 10 of the substrate 4 enables to easily judge the conditions of the solder connection parts.

Inventors

  • 👤 Yutaka Tokunaga
  • 👤 徳永 豊

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-04 07:22
CPC Classifications
H; H10; H10P; H10P74/00; H10W; H10W90/00; H10W90/701; H05; H05K; H05K1/00; H05K1/02; H05K1/0266; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/50

Claims Analysis

Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Maintenance schedule is calculated for granted US utility patents.

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag