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JPS6074447A Expired / Lapsed JP ⏱️ 0.0 years remaining

Bonding device

Assignee: Hitachi Ltd
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Filing: 1984-09-03
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Granted: —
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Expires: 2004-09-03
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Abstract

Abstract PURPOSE:To enhance the positioning accuracy as well as to enable to perform a high speed responsiveness operation of the title device by a method wherein a linear motor is used as the source of vertical movement of a bonding arm. CONSTITUTION:A linear motor 30 is used as the source of vertical movement of a bonding arm 16. When the motor 30 is driven, a box part 31 performs a linear movement, and an L-type arm 33 is operated, thereby allowing the arm 16 to perform a vertical movement. As a result, the deterioration in positioning accuracy caused by the movement changing mechanism, which is required for a rotary motor, and the lowering in responsiveness in a high speed operation can be prevented. Also, a highly accurate positioning and a high speed responsiveness can be accomplished.

Inventors

  • 👤 Shunichiro Fujioka
  • 👤 俊一郎 藤岡

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-01 23:37
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/073; H10W72/07331; H10W72/07337

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