Resin sealed type semiconductor device and manufacture thereof

Abstract

Abstract PURPOSE:To make the entire outer configuration small and to achieve high density mounting, by providing an insulating mesh member, which combines inner leads themselves and tie bars and reinforces them, at the parts of the inner leads and the tie bars. CONSTITUTION:A die pad 1, a semiconductor chip 10, which is fixed to the die pad 1, and inner leads 3 are molded by a resin 12. An insulating mesh member 20 such as a polyimide net is stuck to the lower parts of a the die pad 1 and the inner leads 3, and the resin sealed type semiconductor device is reinforced. In this consitution, outer leads 4 can be bent before the molding by the resin 12, and the outer configuration of the entire body can be made small.

Inventors

• 👤 Takeyumi Abe
• 👤 阿部　剛弓

Bibliographic Details