Solid-state image pickup device

Abstract

Abstract PURPOSE:To facilitate the constitution of an optical path and improve the reliability of a device by fixing a solid-state image pickup element to the bottom part of a resin envelope structure which has an opening at the upper part, sealing the opening with a transparent flat plate, and filling transparent resin between the flat plate and image pickup element. CONSTITUTION:A base board placing part 7 and a lead frame having plural lead-out conductors 8 are molded with mold resin to constitute the resin envelope structure 9 having the opening at the upper part. The solid-state image pickup element 3 is stuck to the mount part 7 of the bottom part of the envelope structure 9 with Ag paste. This element 2 and lead-out wires 8 are connected together with metallic thin wire 3 and transparent resin 10 is dropped on the surface of the element 2. This resin 10 uses silicone resin and the transparent flat plate 5 is fixed to the opeing part of the envelope structure 9 with an adhesive 4. The transparent resin 10 is filled between the flat plate 7 and element 2, and used as the effective optical path of the solid-state image pickup device to improve the reliability of the device.

Inventors

• 👤 Tomio Okamoto
• 👤 岡本　富美夫

Bibliographic Details