Integrated circuit device

Abstract

Abstract PURPOSE:To advantageously prevent the electrostatic breakdown by insulating in a direct current manner from a terminal of part of a chip of an integrated circuit to an external lead terminal and capacitivity bonding the input terminal to the external lead terminal. CONSTITUTION:The electrode of part of a plurality of electrodes on an integrated circuit chip is capacitively coupled to an external lead terminal. For example, an alumina film 12 formed by an anodic reaction or sputtering, or a dielectric film 13 formed by sputtering or CVD is formed in 0.2-3mum on a pad 11, and wired via gold wirings 14 to the lead 15 of a base ribbon from above. The humidity is similarly improved to other portion by a protective film 13 of the pad. The applicable pad cannot become a power line, and even if it is isolated in a direct current manner from the external lead, the pad 11 and the wirings 14 are limited to a terminal for transmitting a signal via a capacitive bond.

Inventors

• 👤 Kazutoshi Kamibayashi
• 👤 和利 上林

Bibliographic Details