Polyphenylene ether composition having improved molding characteristics

Abstract

Abstract PURPOSE:The titled composition having extremely improved molding and processing properties without damaging heat resistance, obtained by blending a polyphenylene ether with a specific diamide compound. CONSTITUTION:A polyphenylene ether or a composition of it and a styrenic resin is blended with a diamide compound shown by the formula [R<1> is C1-10 straight-chain(may have side chain)hydrocarbon residue, alicyclic hydrocarbon residue, aromatic hydrocarbon residue, or its derivative residue; R<2> and R<3> are as shown for R<1>, and R<2> and R<3> may be the same or different]. 0-200pts.wt. styrenic resin is used based on 100pts.wt. polyphenylene ether. The diamide compound has preferably 105-350 deg.C melting point, and the amount of it added is 0.1-25pts.wt., preferably 2-10pts.wt. based on 100pts.wt. total polymers.

Inventors

• 👤 Toshiyuki Tayama
• 👤 利行 田山
• 👤 Ryohei Tanaka
• 👤 良平 田中

Bibliographic Details