Treating process of semiconductor wafer

Abstract

Abstract PURPOSE:To enable to remove surely static electricity from a semiconductor wafer even when static electricity is of a high voltage by a method wherein directly before the semiconductor wafer is to be put in a semiconductor manufacturing device, ionized air is blown against the wafer. CONSTITUTION:A spin dryer 11 is set up in a clean bench 12, and down flowing air 13 is ionized. At this case, air 13 ionized directly before wafers 14 and jigs 15 are to be put in the dryer 11 is blown against the wafers 14 and the jigs 15 to remove static electricity thereof. Static electricity thereof is removed similarly when the wafers 14 and the jigs 15 are taken out from the dryer 11. Therefore, the wafers 14 and the jigs 15 can be prevented from attraction of dust. Moreover air is ionizable easily. Accordingly, removal of static electricity can be attained effectively by using the ionized air 13 thereof.

Inventors

• 👤 Hideaki Sato
• 👤 佐藤　秀秋

Bibliographic Details