Semiconductor device

Abstract

Abstract PURPOSE:To improve the density of mounting easily by respectively fitting chips, chip selective logics thereto differ to each other, to the surface and back of a molding ribbon so as to be mutually arranged in symmetrical manner regarding the position of a junction pad. CONSTITUTION:A ROM chip 100 is fixed to an island 500 in the surface A of a molding ribbon and wired 200, and a ROM chip 300 is set to an island 600 in the surface B and wired 400. Since both surfaces are arranged in symmetrical manner while using X-Y lines as axes, all pins are connected in common through a resin seal, thus obtaining a ROM, capacitance thereof is magnified in double. The areas of the island sections can be reduced, a connection is simplified, and a device having the high density of mounting is acquired.

Inventors

• 👤 Tetsuzo Taniguchi
• 👤 谷口　徹三
• 👤 Seietsu Tanaka
• 👤 田中　誠悦

Bibliographic Details