Resin-sealed type semiconductor device

Abstract

Abstract PURPOSE:To enable to mount a pellet enlarged by increase of density of a semiconductor element on the titled device having the same dimension as ever by a method wherein the width for resin sealing positioned above leads is enlarged to the bending position of outer leads. CONSTITUTION:The width B' of resin sealing positioned above the leads is enlarged almost to the same position as that of the width A of outer lead bending, thus enabling to amount the larger pellet 23. There is no generation of resin cracks in pellet ends 24, and the reliability is excellent. On the other hand, the width B'' of resin sealing below the leads is smaller than the width A and equal to that for the conventional semiconductor device. Accordingly, the outer leads 1 are sufficiently held by a bending jig 101 and then can be bent with a roller 102. Therefore, no gaps generate at the interface between the leads 1 and the resin 2, leading to the excellence in moisture resistance.

Inventors

• 👤 Koji Horiuchi
• 👤 堀内　孝司
• 👤 Akiyuki Motoki
• 👤 元木　晶幸

Bibliographic Details