Copper-containing electroconductive coating

Abstract

Abstract PURPOSE:The titled coating that contains as an electroconductive filler a copper powder which has been prepared by treating a copper powder with an organic carboxylic acid and further treating with an antioxidant, thus being suitable for use as a paste for integrated circuits and an electroconductive adhesive, because it causes scarce reduction in electroconductivity and reduced formation of vergigris. CONSTITUTION:The objective coating is obtained by adding, to a coating base as an electroconductive filler, an antioxidative copper powder which has been prepared by treating a copper powder with an organic carboxylic acid such as a hydroxycarboxylic acid and then treating the product with, e.g., 0.1-5wt% of an antioxidant selected from phosphoric esters, phosphatidic acid derivatives, alkylimidazole, organic carboxylic acid salt of alkylimidazole, nitrogen silane coupling, sulfur silane coupling agent, phenotiazine, thionine and stearylpropylenediamine. EFFECT:It gives films of high resistances to humidity and heat.

Inventors

• 👤 Shoji Yamada
• 👤 山田　祥司
• 👤 Kimiko Yamada
• 👤 山田　基美子

Bibliographic Details