Manufacture of package for semiconductor device

Abstract

Abstract PURPOSE:To facilitate the injection of resin by a method wherein the mold with which resin is sealed into a semiconductor device is composed of a top force and a bottom force, and when the lead of the lead frame whereon a semiconductor device is mounted is pinched by the top and the bottom forces, an aperture having sufficient area is provided on the top force, and said aperture is blocked up using a quartz plate and the like after the resin has been sealed. CONSTITUTION:The semiconductor chip 17 of EPROM and the like is placed in the mold of a package, and when a resin sealing is performed thereon, the mold is divided into the top and the bottom forces, and the lead frame whereon a chip 17 is mounted is pinched by these forces. To be more precise, the chip 17 is fixed to the land part of the lead frame, and the pad pvovided on the chip 17 is connected to the pad located at the lead chip of the frame. According to this constitution, a plurality of recessed parts 28 for reinforcement are provided on the bottom face of the lower force, and an aperture 29 of sufficient area corresponding to the chip 17 is provided on the top force. Subsequently, sealing resin is injected into the aperture 29, and the surface of the aperture 29 is blocked up by an ultraviolet ray transmitting plate 42 such as a transparent alumina plate and the like.

Inventors

• 👤 Seietsu Tanaka
• 👤 田中　誠悦
• 👤 Tomiichi Shibata
• 👤 柴田　富一

Bibliographic Details