Manufacture of semiconductor package with capacitor

Abstract

Abstract PURPOSE:To simplify a process and reduce a manufacturing cost by adopting the same raw material for a package and a capacitor. CONSTITUTION:A capacitor internal electrode is formed on a base green sheet 11 whose main component is alumina by printing of metallized paste. Capacitor internal electrodes are also formed on laminar green sheets 13-19 whose main component is alumina by printing. The sheets 13-19 are laminated and bonded on the sheet 11 to form a capacitor part. An island printed plane 22 and an external lead out wiring 22a are formed on a green sheet 21. Green sheets 23, 26 are laminated and bonded on the sheet 21 to form a package part. The package part is mounted on the capacitor part and both parts are sintered and solidified, integrally.

Inventors

• 👤 Nobuhiko Miyawaki
• 👤 宮脇　信彦
• 👤 Asao Morikawa
• 👤 森川　朝男
• 👤 Rokuro Kanbe
• 👤 六郎 神戸
• 👤 Hisaharu Shiromizu
• 👤 白水　久晴

Bibliographic Details