Integrated circuit device

Abstract

Abstract PURPOSE:To enable to mount an extra-high integrated IC chip on a microminiature type carrier by a method wherein an external connection terminal pad is arranged in lattice form on the reverse side of a substrate, and a structure in which the main body of the IC chip is bonded on the cover side having excellent thermal conductivity is formed. CONSTITUTION:A plurality of bonding pads 12, which are equal in number to the terminal of an IC, are formed on the surface of a substrate 7, and the IC lead 11 of an IC chip 8 is connected by bonding to said bonding pads. Also, a plurality of connection wirings 17 formed on the surface of the substrate 7 are connected to the bonding pad 12, and the connection wiring 17 is connected to the terminal pad 10 through each via hole wiring 16 formed in the substrate 7. The bonding pad 12 is connected to the via hole 16 through the intermediary of the connection wiring 17, each via hole wiring 16 passes through the substrate 7 and connected to each terminal pad 10 located on the back side.

Inventors

• 👤 Yuji Iwata
• 👤 岩田　勇治

Bibliographic Details