Manufacture of semiconductor wafer

Abstract

Abstract PURPOSE:To check to cause deterioration of quality of a wafer main body when a discriminating mark is to be carved by a method wherein the discriminating mark is formed in a bar code type to the peripheral edge part of the wafer according to a rotating grinding blade. CONSTITUTION:An orientation flat 2 is formed on one edge part of a wafer 1, and a slope 3 is formed using a grinding whestone. Then, a discriminating mark 5 is carved in a bar code type along the longitudinal direction of the slope 3 using an extremely thin grinding blade 4. The grinding blade 4 thereof is supported coaxially by a flange 6. The wafer 1 is displayed timely in an arrow mark 8 direction and in an arrow mark 9 direction, and the grinding blade 4 performing a rotation is made to come in contact with the slope 3 to carve the discriminating mark 5. The discriminating mark 5 thereof is consisting of a combination of parallel straight lines, and the discriminating mark is indicated according to the intervals between the straight lines.

Inventors

• 👤 Nobushi Suzuki
• 👤 鈴木　悦四
• 👤 Masaaki Kuniyoshi
• 👤 国吉　真暁

Bibliographic Details