JPS60210643A Expired / Lapsed JP ⏱️ 0.0 years remaining

Filler and its composition

Assignee: Denka Co Ltd

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Filing: 1983-11-30

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Granted: —

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Expires: 2003-11-30

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Abstract

Abstract PURPOSE:A filler for resins which, when added to a thermosetting resin, can provide a resin composition having high flow and being excellent in finning property and electrical insulation, prepared by mixing two kinds of fused silicas of different shapes together. CONSTITUTION:A filler for resins, prepared by mixing 5-95pts.wt. spherical fused silica particles having a particle diameter <=149mu and an aspect ratio of 1-1.5 with 95-5pts.wt. ground fused silica particles having a particle diameter <=149mu and an aspect ratio >=1.6. Said filler is added to a thermosetting resin (e.g., epoxy resin, phenolic resin, or polyester resin) in an amount to provide about 30-80wt%, based on the resin composition.

Inventors

👤 Akira Kobayashi
👤 晃小林
👤 Ryoichi Ide
👤 井手　亮一
👤 Hirotaka Koga
👤 博隆古賀

Bibliographic Details

Application Number —

Jurisdiction JP

Data Source google_patents

Last Synchronized 2026-11-08 23:39

CPC Classifications

C; C08; C08K; C08K7/00; C08K7/16; C08K7/18; C08K3/00; C08K3/34; C08K3/36; C08K7/20; C08L; C08L87/00; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K7/00; H05K7/005; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473; C08K2201/00; C08K2201/016; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2203/00; H05K2203/13; H05K2203/1305; H05K2203/1316

Claims Analysis

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References Cited (Backward Citations)

JPS49110734A Cited

JPS548696A Cited

JPS57187354A Cited

JPS58138740A Cited

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