Processing of semiconductor wafer

Abstract

Abstract PURPOSE:To prevent peeling off of an element of small piece from a bonding thin plate when a semiconductor wafer is to be cut into elements of small pieces, and to prevent scattering of the adjoining elements of small pieces after the wafer is cut by a method wherein after the semiconductor wafer is cut to be separated into the elements of small pieces using the specified bonding thin plate, the small pieces thus produced are picked up. CONSTITUTION:As a light transmissible suporter to construct a bonding thin plate to be used, namely as a supporter having the property enabled to transmit light of 180- 460nm wavelength normally, a plastic film of polyvinyl chloride, polyethylene terephthalate, polyethylene, polypropylene, etc. is used. After a semiconductor wafer is sticked to be fixed to the thin plate, the wafer thereof is cut into elements of small pieces according to a rotating circular knife. After then, light of wavelength of 180-460nm is projected for the degree of several seconds or several minutes according to a high pressure mercury lamp, an extra-high pressure mercury lamp, etc. from the supporter side of the thin plate only to the parts of the bonding thin plate (a pressure-sensitive adhesive layer) corresponding to the elements of small pieces to be picked up. The pressure-sensitive adhesive layer at the projected part is hardened to be formed into a three-dimentional reticular type.

Inventors

• 👤 Takemasa Uemura
• 👤 植村　剛正
• 👤 Yoshinari Satoda
• 👤 良成 里田
• 👤 Eiji Shigemura
• 👤 重村　栄二
• 👤 Zenzo Honda
• 👤 本多　善三
• 👤 Yujiro Kawashima
• 👤 裕次郎 川嶋

Bibliographic Details