Arrangement modifying device for wafer

Abstract

Abstract PURPOSE:To enable to modify arrangement of disorderly arranged semiconductor wafers in regard to the lot number, to be arranged in conformity with the order of the lot number automatically by a method wherein the wafers accommodated in a third wafer cassette in accordance with the proper order while making the wafers to perform a reciprocating movement between a first and a second wafer cassettes. CONSTITUTION:After all of the semiconductor wafers carried out from a semiconductor wafer cassette 3 are carried out, the semiconductor wafers are carried out in order from the semiconductor wafers carried into a semiconductor wafer cassette 8 on the contrary to this time from the semiconductor wafer cassette 8 to the direction of the semiconductor wafer cassette 3 passing in a number reading device, and the semiconductor wafers having the coinciding numbers are selected. Accordingly, the semiconductor wafers having the numbers coinciding with the numbers selected by the number reading device are carried in the semiconductor wafer cassette 7 of the regular order, while the semiconductor wafers having the uncoinciding numbers are carried in the semiconductor wafer cassette 3, and reciprocation of the semiconductor wafers thereof is continued up to complete modification of arrangement of the semiconductor wafers.

Inventors

• 👤 Hideaki Ozawa
• 👤 小沢　英明

Bibliographic Details