Semiconductor device

Abstract

Abstract PURPOSE:To prevent the generation of exfoliation of a projected electrode and to suppress the voltage drop due to wirings by connecting the 1st conductor lead to the projected electrode formed at the surrounding part of a semiconductor element, and connecting the 2nd conductor lead to the projected electrode formed at the inside of the semiconductor element. CONSTITUTION:A conductor lead 3 constituting a film carrier with a base film 4 and drawn therefrom is connected to the projected electrode 2 provided at the surrounding part of the semiconductor element 1. Further, a conductor lead 8 for power line is drawn from the base film to the inside of the semiconductor element 1, branched and connected to the projected electrodes 6, 6a provided at the inside of the semiconductor element 1. Through the construction above, edge- touch is prevented and also the projected electrode (b) and the projected electrode 6a are connected by the curved conductor lead 8, and the projected electrode 6 and a dummy projected electrode 6b are not connected mechanically, so that the thermal stress due to the difference in thermal expansion coefficient between the semiconductor element 1 and the conductor lead 8 is absorbed by the curved part and the dummy projected electrode 6b.

Inventors

• 👤 Izumi Okamoto
• 👤 岡本　泉
• 👤 Masayoshi Mihata
• 👤 御幡　正芳

Bibliographic Details