Lead frame for semiconductor integrated circuit device

Abstract

Abstract PURPOSE:To reduce the common impedance section of leads to the possible minimum by forming a stepped section to a stitch section, forming the stitch in L-shaped or T-shaped structure and contain the leads divided up to their midways by slits. CONSTITUTION:Stitch sections 206b, 206c are formed to a T shape to an external leading-out section in a lead 206 in leads 101-105 and 206 and 107-111. The stitch sections 206b, 206c are divided into two sections of 206b and 206c by a slit 100 from the stitch section side. The stitck sections divided into two sections are pressed so as to be made lower than the surfaces on which other leads 101-105, 107-111 are positioned. The stitch sections corresponding to T- shaped cross-bars are arranged along one side of an island as a fitting section for a pellet for the convenience of wirings, thus constituting a lead frame. Accordingly, the common impedance sections of the leads can be reduced without excessively requiring the number of the leads and drawing around the wirings for the pellet.

Inventors

• 👤 Koichi Tanabe
• 👤 田邊　光一

Bibliographic Details