Wire bonding apparatus

Abstract

Abstract PURPOSE:To enable the correction of position to be performed correctly in accordance with the change in height of a semiconductor substrate, by providing a means for moving a camera for correcting the bonding position and a bonding tool both vertically to a substrate. CONSTITUTION:A bonding head 7 has a slider 12 to which a capillary arm 11 and a clamper 13 are fixed and the slider 12 is made slidable vertically. A computer 19 issues a command in accordance with signals from a position detector 17 and a speed detector 18 so as to control a linear motor 21 such that the unit performs bonding operation. A camera 25 for correcting the bonding position is fixed to the slider and slidable vertically. Even if the height of a chip or of a substrate is changed, or even if one substrate has chips with different heights, the unit can be accommodated to such a situation only by setting the height of the capillary 10. Further, each height data may be set previously so that a semiconductor chip 1 and a substrate 2 can be caught at the point nearest to the focus of the camera.

Inventors

• 👤 Yutaka Makino
• 👤 豊 牧野
• 👤 Takeichi Yoshida
• 👤 吉田　竹一
• 👤 Seishirou Yanaike
• 👤 征志郎 梁池

Bibliographic Details