Film having periodic multi-layered structure

Abstract

Abstract PURPOSE:To obtain a film which has a periodic multi-layered structure, is chemically and physically stable and is applicable to various electronic apparatus by laminating alternately silicon oxide films and metallic films at a specified film thickness ratio. CONSTITUTION:A substrate 1 is placed in an upper part and a cooling pipe is provided in the place of the substrate 1 to cool the substrate. The substrate 1 can be heated by a heater 2 if necessary. Thereare two vapor sources 31, 32 in the lower part to evaporate respectively SiO powder and cobalt metal. The inside of a vacuum vessel 100 is evacuated to a high vacuum of <=about 5X10<-6> Torr and thereafter the sources 31, 32 are moved to evaporate alternately Co and SiO thereby forming the films laminated periodically with Co and SiOx. Glass is used for the substrate and is subjected to the vapor deposition under water cooling. The film thickness is monitored by a quartz oscillation type film thickness gage 5. When the prescribed thickness is attained, a shutter is closed and the vapor sources are moved, then the shutter is opened to evaporate the other material.

Inventors

• 👤 Hisanori Bando
• 👤 坂東　尚周
• 👤 Takahito Terajima
• 👤 孝仁 寺嶋

Bibliographic Details