Handling method and apparatus of wafer

Abstract

Abstract PURPOSE:To avoid damage of resist and contamination by dust and maintain highly accurate flatness by a method wherein a periphery of a wafer is held by a holding member provided in a load chuck and, after rough alignment made by rotation, the wafer is transferred onto a wafer chuck and the flatness is adjusted. CONSTITUTION:When a wafer 1 is brought under a load chuck, an arm 14 is descended. When a pressing force of a cylinder 30 is released, a lever 27 is rotated by a spring 29 with a fulcrum shaft 28 as a center and a periphery of the wafer 1 is held by rollers 20, 25 and a movable roller 26. At this state, a motor 24 is driven and the wafer 1 is rotated to the arrow direction by a driving roller 21 and when the orientation flat touches the roller 20 a repulsion sensor 31 operates to stop the motor 24. The X-direction positioning of the wafer 1 is made by the roller 20 and the Y-direction positioning is made by the roller 25. Then the arm 14 is ascended and rotated and the wafer 1 is transferred onto a wafer chuck and the flatness of the wafer 1 is adjusted by, for instance, operating a piezo element 33.

Inventors

• 👤 Hidezo Sano
• 👤 秀造 佐野
• 👤 Minoru Ikeda
• 👤 稔 池田

Bibliographic Details