Semiconductor device

Abstract

Abstract PURPOSE:To enable to easily perform the positioning of the container of a semiconductor element and the cap of the container, and also, to contrive to enable to upgrade the airtightness and mass productivity of the element by a method wherein a step part is provided along the inner circumference of the aperture of the container and a sealing is peroformed inbetween the container and the cap along the step part using melted glass. CONSTITUTION:A step part to prescribe the fixed position of a cap 5 is prepared being formed along the inner circumference of the aperture of a ceramic container 1. A semiconductor element 2 is fixed with an Ag paste 11 and so forth and after the semiconductor element 2 was connected 3 with metallized wirings 4, the cap 5 is inserted in the stepped part and a casting sealing is performed in the gap between the container 1 and the cap 5 using a melted glass material 6. Or, the melted glass material 6 is previously applied on both of a part of the lower surface, which corresponds to the stepped part, and the stepped part and the gap may be sealed by making the container with the cap pass through a furnace, According to this constitution, the positioning of the container and the cap becomes easier. As a result, the airtightness and mass productivity of the semiconductor device are both improved.

Inventors

• 👤 Ryohei Saga
• 👤 嵯峨　良平

Bibliographic Details