Resin-sealed type semiconductor device

Abstract

Abstract PURPOSE:To enhance the effect of preventing the moisture-resistance deterioration of the titled device due to the thermal stress at the time of solder dipping by sealing with a synthetic resin having a specific rate of molding shrinkage and an average rate of thermal expansion. CONSTITUTION:The higher is the compression stress of resin applied to a semiconductor device before solder dipping, the more excellent is the moisture resistance of the semiconductor device due to the thermal stress at the time of solder dipping. In other words, sealing a semiconductor element with a resin having the characteristic that the rate of molding shrinkage at 175 deg.C exceeds 0.65 and the average rate of thermal expansion in a range of 25 deg.C-150 deg.C is 2.5X10<-5>/ deg.C or less causes no decrease in adhesion property of resin with a lead frame interface even under solder dipping. In the concrete, epoxy resin, phenol resin, silicone resin, or diallyl phthalate resin is used for sealing.

Inventors

• 👤 Toshio Oishi
• 👤 敏夫 大石

Bibliographic Details