Miniature electronic component

Abstract

Abstract PURPOSE:To enable high mounting density and contrive not to place the restrictions in the substrate material by a method wherein a plurality of leads made of a plurality of pins are planted at right angles to the main surface of a package body, the tips of which leads are then connected to a wiring on the substrate. CONSTITUTION:A plurality of the pin-formed leads 10 are planted in the ceramic package body 1 at right angles to the main surface of the body 1. The tip of the lead 10 is connected to the wiring 8 on the body 1. Such a construction enables to obtain a mounting density close to that of leadless connection and further to impose no restrictions on the choice of material for the mounted substrate.

Inventors

• 👤 Kanji Otsuka
• 👤 寛治 大塚
• 👤 Hajime Murakami
• 👤 元 村上

Bibliographic Details