Semiconductor light emitting device

Abstract

Abstract PURPOSE:To facilitate the alignment and to realize reproducibly a high coupling coefficient against an optical fiber, by providing with a spherical or semi-spherical lens which contacts a semiconductor device substrate and three or more projections formed so as to contact the lens and which is bonded to them with an adhesive. CONSTITUTION:On a light emitting diode substrate 1, three or more projections 9 are formed with spaces away from one another and a lens 2 is positioned by the projections 9 and bonded to them. The center among the projections 9 is caused to coincide with the center of the light emitting area. The projections 9 which are rectangular parallelepipeds contact lens 2 so that the lens 2 can contact the LED substrate 1. Since wide gaps are being defined between each of projections 9, the adhesive 4 flows out of the gaps in every direction, when the lens 2 is pushed against the LED substrate 1. In this way, the lens 2 can contact the LED substrate 1 at the point A. Except the point A, the adhesive 4 is being interlaid between the lens 2 and the substrate 1, but the adhesive layer is thin.

Inventors

• 👤 Hiroshi Okuda
• 👤 奥田　寛

Bibliographic Details