Semiconductor device

Abstract

Abstract PURPOSE:To enable outside print wiring and the like to be easily performed by a method wherein the upper part of the outer package is provided inside with holes or cutouts so that outer terminals may come into the position securely. CONSTITUTION:An insulation substrate 2 is placed on a heat dissipation plate 1 via solder thin piece. Next, a collector electrode 3C, a base electrode 3B, an emitter electrode 3E are mounted on this insulation substrate 2 via solder thin piece, respectively; further, a transistor element 4 is arranged on the collector electrode 3C via solder thin piece. Then, respective electrodes 3B, 3C, and 3E corresponding to bonding pads on the transistor element 4 are wire-bonded with aluminum wires. The tips of the respective electrodes 3B, 3C, and 3E are bent and raised upward, and are then connected to the outer terminals 9-15 by soldering or the like. In the case of adhering the outer package 5 on the heat dissipation plate 1, the outer terminals 9-15 are inserted into the holes 8. Thereafter, the lower layer inside the package 5 is sealed with a gelled sealing resin 6, and the upper layer with a hardened type sealing resin 7 to fix the terminals 9-15.

Inventors

• 👤 Yoshio Takagi
• 👤 義夫 高木

Bibliographic Details