Manufacturing equipment of semiconductor device

Abstract

Abstract PURPOSE:To prevent generation of a water drop in a branch tube, to increase the manufacturing yield of a semiconductor product and to improve reliability by enclosing a branch tube connected to the core tube of a furnace with a cover which reflects radiant heat in an equipment of forming a semiconductor oxidized film by pure water heating system. CONSTITUTION:A semiconductor wafer 4 supported by a quartz jig 3 is inserted in a furnace core tube 2 installed in a heat treatment furnace 1 and a semiconductor oxidized film is formed by reacting the semiconductor 4 with oxygen gas from a pure water heater 5 and a gas 8 containing steam. Outside of a branch tube 9 made of quartz and connects the pure water heater 5 and the furnace core tube 2, a cover 11 is provided to prevent a water drop. The cover 11 made of a heat-resisting material which reflects radiant heat, e.g., an aluminum foil or an aluminum plate is wound around the branch tube in a cylindrical shape. Local abnormal oxidization of the water or adhesion of minute dust of quartz to the wafer is prevented.

Inventors

• 👤 Noboru Tatefuru
• 👤 立古　昇

Bibliographic Details