Socket for semiconductor device

Abstract

Abstract PURPOSE:To produce the titled socket with reduced flat area having no influence upon the function thereof by a method wherein terminals may be shortcircuited or disconnected as necessary by means of inserting into or pulling out pins while semiconductor devices are vertically heaped. CONSTITUTION:A pin 7 connecting upper and lower sockets 9 connects No.1, No.3-No.13, No.15, No.16 of socket terminals while connecting to a substrate circuit at a part 11 by soldering process etc. The other terminals i.e. No.2, No.14 of the lower socket 9 are connected to a substrate by another pin 12 or connected to any circuit as necessary from the side terminal of the socket 9 by soldering process etc. just like the other socket. Through these procedures, any flat area may be extremely reduced since a conductor device 6 such as RAM etc. may be vertically heaped to make up circuits as necessary.

Inventors

• 👤 Hiroyoshi Ohira
• 👤 大平　廣吉

Bibliographic Details