Semiconductor device

Abstract

Abstract PURPOSE:To simplify the layout and formation of a wiring by a method wherein a plurality of resin substrates are provided, and each of said resin substrates is electrically connected. CONSTITUTION:A plurality of semiconductor element-formed pellets 3 are bonded on the surface of the first substrate 1. On the surface of the first substrate 1 located on the circumference of the pellet 3, a plurality of the first plate-surface wirings 4 are formed, and they are connected to the electrode of the pellet 3 using a bonding wire 5. On the circumferential part of the first substrate, a plurality of lead pins 6, which are installed vertically to the first substrate 1 and the second substrate 2 penetrating the second substrate 2, are arranged at the prescribed pitch. Said lead pins 6 consist of a 42 alloy, a Kovar alloy and the like, and it is formed in the size which can be electrically connected to a mounting substrate 7. Also, a contact pin 8, which is shorter than the lead pin 6 and not connected to the mounting substrate 7, is installed vertically to the first substrate 1 and the second substrate 2 at the arbitrary position between said substrates 1 and 2.

Inventors

• 👤 Ken Okuya
• 👤 謙 奥谷
• 👤 Kanji Otsuka
• 👤 寛治 大塚
• 👤 Masayuki Shirai
• 👤 優之 白井
• 👤 Masaya Ishii
• 👤 雅也 石井

Bibliographic Details