Multi-chip-module

Abstract

Abstract PURPOSE:To improve the cooling efficiency of IC chips, power consumption thereof is large, while easily exchanging the chips when the chips get trouble by directly fixing cooling fins onto the chips and unifying them while receiving these chips and fins into sealing structure and forcibly convection-cooling them by using a liquid medium flowed in from the outside in a multi-chip-module in which a large number of the IC chips are mounted on a wiring substrate. CONSTITUTION:A plurality of IC chips 2, the surfaces thereof have cooling fins 1, are fixed onto a wiring substrate 3, from the back thereof a large number of module pins 6 for connecting to a circuit board, etc. are projected and which consists of ceramics, etc., through solder terminals 5 at regular intervals, and these fins, chips and terminals are covered with a sealing cap 4. Clearances among the lower surface of the cap an the upper surfaces of the fins 1 are made previously approximately the same as spaces among the fins 1 at that time, and a pass-through on the fins 1 of the greater part of a refrigerant such as Freon flowing into the cap is prevented. The refrigerant is fed in from a nozzle 7a formed to the cap 4, and discharged from a nozzle 7b. The chps 2 are exchanged by heating, etc. by laser beams.

Inventors

• 👤 Keiichiro Nakanishi
• 👤 中西　敬一郎
• 👤 Minoru Yamada
• 👤 稔 山田
• 👤 Masakazu Yamamoto
• 👤 雅一 山本
• 👤 Minoru Tanaka
• 👤 稔 田中

Bibliographic Details