Semiconductor package

Abstract

Abstract PURPOSE:To obtain the rapidity in the process of stacking and the certainty of fixing at the time of soldering by a method wherein the root of an outer lead is provided with a recess, and the lead tip with an engagement part. CONSTITUTION:The root of the outer lead 3 stretching out of a package body 1, the sealing structure, is provided with the recess 6. The tip of the outer lead 3 is provided with the engagement part 7 made different in width, which is engaged by inserting its tapered part into the recess 6 at the root of the outer lead 4 of the lower stage package 2. Fixing is performed by attaching a solder 5 in a solder bath in this state. The recess 6 at the root of the outer lead and the tip engagement part 7 are molded at the step of lead frame processing.

Inventors

• 👤 Koji Nose
• 👤 幸之 野世
• 👤 Shigeru Tanaka
• 👤 茂 田中

Bibliographic Details