Semiconductor device mounting structure

Abstract

Abstract PURPOSE:To correct an improper portion by pressing an elastic member through a conductive rubber on a substrate and a semiconductor device. CONSTITUTION:In order to place an IC5 and a conductive rubber connector 7 at the prescribed positions on glass substrates 1, 2, a guide frame 6 is previously secured onto the substrates 1, 2. A retainer spring 8 presses substantially the center of the IC5. The pressing of approx. 3gr per bump is sufficient, and no influence is recognized to the IC5. If an improper portion is presented after inspecting the assembling, the spring 8 is removed to exchange the connector 7, and the IC5. When the completely good device is confirmed as a liquid crystal indicator, epoxy resin is molded at the periphery of the IC5 to protect the IC5.

Inventors

• 👤 Yoshio Iinuma
• 👤 飯沼　芳夫
• 👤 Toshio Kojima
• 👤 敏夫 小嶋
• 👤 Akihiko Okano
• 👤 明彦 岡野

Bibliographic Details