Multilayer interconnection

Abstract

Abstract PURPOSE:To accelerate the operational speed by a method wherein conductive layers are composed of the first conductive layers formed of one conductive material such as copper or copper alloy and the second conductive layers formed of the other conductive material such as aluminium or aluminium alloy so as to envelop the first conductive layers. CONSTITUTION:An insulating layer 5 is formed on the upper part of a substrate 1. The first layer wirings 2A are formed on the upper part of the insulating layer 5 of a region whereon the first layers are to be formed as well as the upper part of a photoresist layer 10 excluding said region. For example, conductive layers 2D made of one conductive material such as aluminium or aluminium alloy are formed while the other conductive layers 2C made of the other conductive material such as copper or copper alloy are formed on the surface of the conductive layers 2D. Moreover the conductive layers 2D are formed so as to cover the surface of the conductive layers 2C. Through these procedures, the first layer wirings 2A may be formed so that the conductive layers 2C may be enveloped in the conductive layers 2D.

Inventors

• 👤 Toshihiko Sato
• 👤 俊彦 佐藤

Bibliographic Details