Ni-plating of lead of ic package

Abstract

Abstract PURPOSE:To prevent the deterioration of the adherence of tin plating and the occurrence of improper solder wettability by setting Co content of Ni-plating film to the specific value or lower. CONSTITUTION:Co content of Ni-plating film of an IC package lead Ni-plated at the leads connected to a connector is decided to 5wt% or lower. The Co is readily oxidized as compared with Ni, and the produced oxide is dense, it is difficult to remove the pretreatment such as tin plating and has wrong solderability. Accordingly, Co amount in Ni-plating film is set to 5wt% or lower, thereby improving the solderability of connecting leads, providing excellent heat resistance characteristic, and improving stability in the quality and durability.

Inventors

• 👤 Akiyo Kasugai
• 👤 春日井　明世

Bibliographic Details