Radiation-curing pressure-sensitive adhesive composition

Abstract

Abstract PURPOSE:To provide the titled adhesive compsn. having excellent adhesion properties without emission of unpleasant odor, prepd. by adding a reaction product of a dithiol and an alkyltin oxide to a radiation-curing liquid oligomer having a radical-crosslinking ethylenically unsatd. double bond. CONSTITUTION:A reaction product having no unpleasant odor peculiar to thiol is prepd. by reacting 0.1-1mol of an alkyl tin oxide (e.g. dimethyltin oxide or monomethyltin hydroxide) to 1mol of a dithiol (e.g. ethanedithiol or butanedithiol). The adhesive compsn. is obtained by adding 0.5-30pts. said reaction product to 100pts.wt. radiation-curing liquid oligomer (e.g. acrylic oligomer) having a radical-crosslinking ethylenically unsatd. bond in the molecule. The compsn. has little unpleasant odor even after irradiation to radiation.

Inventors

• 👤 Tomohisa Oota
• 👤 共久 太田
• 👤 Akihiko Dobashi
• 👤 明彦 土橋
• 👤 Toshishige Uehara
• 👤 寿茂 上原

Bibliographic Details