Testing method of probe of integrated circuit

Abstract

Abstract PURPOSE:To obtain an accurate test result by performing a chip probe test after cutting a wafer to chips, thereby improving the positioning accuracy of the probe irrespective of the size of the wafer. CONSTITUTION:A chip supply unit 1 cuts a wafer into chips 10, picks up the chips 10 of the state held in the shape of the wafer and places them on moving rails 5. Then, an island unit 2 moves the chips in X- and Y-axis direction on a chip stage 61 formed on a rotary stage 6 or rotates to position them and then secures the chips to the stage 61. Then, the chips are moved by rotating by the stage 6 to the underneath the probe card of a measuring unit 3. Then, the probe card is contacted with the chips to fed an electric signal form the card to measure. The chips tested are contained by collets 41, 42 in a chip container 4 on chip trays 43, 44.

Inventors

• 👤 Hiromichi Mori
• 👤 森　宏道
• 👤 Yoji Murakami
• 👤 洋二 村上

Bibliographic Details