Semiconductor device and manufacture thereof

Abstract

Abstract PURPOSE:To produce a thinner semiconductor device with specific thickness while improving the mass productivity by a method wherein a hole is made in a film carrier and after a pellet is inserted into the hole and putting of resin, the upper surface of the hole is covered with a sealing plate to be sealed with resin so that the lower surface of the film carrier, the pellet and the resin may be made almost flush. CONSTITUTION:A pellet 2 around 200mum thick is sealed with resin 5 in a hole provided in a film carrier 8 around 350mum thick. The film carrier 8, the pellet 2 and the resin 5 are formed so that their lower surfaces may be made flush while the upper surface of the hole is covered with an insulating sealing plate 9. The bonding wires 4 connecting the pellet 4 with the upper surface of a leading part of the film carrier 8 are held down on the upper surface of said film carrier 8. Through these procedures, a semiconductor much thinner than those utilizing any conventional wires may be formed since its thickness is specified regardless of the loop height of resin and wires.

Inventors

• 👤 Akira Kuromaru
• 👤 黒丸　明

Bibliographic Details