Photosensor and manufacture thereof

Abstract

Abstract PURPOSE:To improve the positional accuracy of a light emitting unit and a photoreceptor by providing a semiconductor light emitting unit, a photoreceptor, a molded opaque resin layer, a light emitting window and a photoreceiving window, thereby manufacturing a photosensor in preferably workability and high productivity. CONSTITUTION:A leadframe 20 in which leads are integrally coupled at the predetermined interval with a frame is employed, a semiconductor light emitting element 12 is mounted on the end of a lead 111, and a semiconductor photoreceiving element 12' is mounted on the end of the lead 11'1. Then, molding layers 14, 14' are formed by transfer molding transparent epoxy resin, and a light emitting unit section and a photoreceptor section are respectively sealed in an indepent state. Subsequently, the leads 111, 112, 11'1, 11'2 are filled in a mold and transfer molded with opaque epoxy resin in the state that these leads are coupled to frames 21, 21' to integrally hold the light emitting unit section and the photoreceptor section, and an opaque epoxy resin layer 16 having a light emitting window 17 and a photoreceiving window 17' is formed.

Inventors

• 👤 Toshiaki Tanaka
• 👤 敏明 田中

Bibliographic Details