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JPS599141A Expired / Lapsed JP ⏱️ 0.0 years remaining

Electrically conductive high-strength copper alloy with softening resistance

Assignee: Dowa Holdings Co Ltd
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Filing: 1982-07-07
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Granted: —
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Expires: 2002-07-07
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Abstract

Abstract PURPOSE:To provide a Cu alloy consisting of prescribed percentages of Ni, Fe, Sn, P and B and the balance Cu with inevitable impurities and having high softening resistance, electric conductivity, platebility, solderability, mechanical strength, etc. CONSTITUTION:This electrically conductive high-strength Cu alloy with softening resistance consists of, by weight, 0.05-0.40% Ni, 0.05-0.40% Fe, 0.05-0.20% Sn, 0.05-0.10% P, 0.005-0.050% B and the balance Cu with inevitable impurities. The Cu alloy has high softening resistance, electric conductivity, heat conductivity, platability, solderability, mechanical strength, etc. Accordingly, the Cu alloy is suitable for use as the material of electric and electronic parts requiring said characteristics, the material of the fins of a heat exchanger, etc.

Inventors

  • 👤 Kazutaka Nakajima
  • 👤 和隆 中島
  • 👤 Osamu Moroi
  • 👤 諸井 修
  • 👤 Takako Sato
  • 👤 貴子 佐藤

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-30 17:13
CPC Classifications
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References Cited (Backward Citations)

JPS50147420A Cited

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