Semiconductor device

Abstract

Abstract PURPOSE:To make a chip on chip constitution easier by a method wherein semiconductor chips are formed of the first and second metallic bumps while the second metallic bumps are coated with another metals with low melting point. CONSTITUTION:Within at least one surface of a semiconductor substrate 11, the first metallic bumps 19 are provided near the periphery of the substrate 11 while the second metallic bumps 20 are provided on different positions on the same surface and the second metallic bumps 20 are coated with another metals 21 with low melting point. The metals 21 with low melting point are composed of metals with lower melting point than that of the bonding parts formed on the first metallic bumps 19.

Inventors

• 👤 Toshio Sonobe
• 👤 園部　俊夫

Bibliographic Details