Electronic circuit device

Abstract

Abstract PURPOSE:To prevent the contact between fine conductor wires, the contact between the fine conductor wires and other circuit pattern, and the disconnection of the fine conductor wires from electrodes by coating a securing material on a substrate between the electrodes provided on the substrate, and securing the fine conductor wires with the securing material. CONSTITUTION:Another circuit pattern 8 is formed between one side face of an IC chip 5 and a circuit pattern 2 opposed to the side face of the chip, and fine metal wires 7 are extended to cross over the pattern 8. Epoxy resin 9 is coated in a strip shape on the pattern 8, and the wires 7 above the pattern 8 are secured at the center by the resin 9. As a result, the wires 7 for connecting between the electrodes 3 and 6 prevent the contact between the adjacent wires 7 or the contact between the wires 7 and the pattern 8. Further, a stress is hardly applied to the connecting points between the wires 7 and the electrodes 3, 6 by the bending or deformation of the exposed part even for the elongation or contraction of the wires 7 due to the environmental variation such as thermal change, thereby obtaining the accurate and stable circuit operation.

Inventors

• 👤 Ichiro Notake
• 👤 野武　一郎
• 👤 Saburo Nakajima
• 👤 三郎 中島

Bibliographic Details