JPS5982736A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Method and apparatus for wire bonding of semiconductor device
Assignee: Oki Electric Industry Co Ltd
•
Filing: 1982-11-04
•
Granted: —
•
Expires: 2002-11-04
Abstract
Abstract Translated from Japanese (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Inventors
- 👤 Yutaka Hojo
- 👤 北城 豊
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-03 22:09
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.