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JPS5979545A Expired / Lapsed JP ⏱️ 0.0 years remaining

Electrostatic chucking device

Assignee: Toshiba Corp
•
Filing: 1982-10-29
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Granted: —
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Expires: 2002-10-29
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Abstract

Abstract PURPOSE:To improve the accuracy of finishing and the accuracy of inspection by detecting currents flowing through an electrostatic chuck proper and judging the state of the attraction of a sample under vacuum from the detecting value. CONSTITUTION:Alumina 12 is flame-sprayed to the whole surface of a conductive substrate 11, and an electrode terminal 13 for a screw is fitted to the lower surface of the substrate 11. The surface of the proper is flattened, and the sample 14 is placed. The positive pole of a power supply 16 is connected to the terminal 13 through a protective resistor 15, and the negative pole of the power supply 16 is connected to the sample 14 through an ammeter 17. High voltage is applied between the substrate 11 and the sample 14, and the sample 14 is chucked on the proper 10. Resistance between the sample 14 and the substrate 11 changes according to the state of attraction, and the indicating value of the ammeter 14 changes. The indicating value is compared with a current value in the case when the sample is chucked positively, and an abnormal signal is outputted when difference exceeds a fixed value. When using the electrostatic chuck by the constitution, the reliability of the fine machining and inspection and the like of the sample are improved.

Inventors

  • 👤 Toru Tojo
  • 👤 東条 徹
  • 👤 Mineo Goto
  • 👤 後藤 峰夫
  • 👤 Kazuyoshi Sugihara
  • 👤 和佳 杉原
  • 👤 Mitsuo Tabata
  • 👤 光雄 田畑

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-04 19:13
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/72; H10P72/50

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