High-density tablet and method of sealing semiconductor with resin using said tablet

Abstract

Abstract PURPOSE:To obtain a high-density tablet that has a compressibility of a specified value or above and will be used for sealing a semiconductor device with a resin by pressing to provide an item without a cavity, by tableting a resin powder under a high tableting pressure. CONSTITUTION:A resin (e.g. epoxy resins, etc.) powder is tableted under a high pressure of 5ton/cm<2> to obtain a high-density tablet having a compressibility of 97% or above. The tablet is charged into a pot of a mold, the resin is plasticized, and a plunger is actuated so that the resin is injection molded in a cavity under pressure. EFFECT:The productivity can be improved by molding under a low pressure, high speed molding, quick hardening, etc.

Inventors

• 👤 Michitoshi Sera
• 👤 世良　通利

Bibliographic Details